A cornerstone of effective STCO is the ability to conduct multi-domain analyses—for example, signal integrity, power integrity, thermal performance, and mechanical stress—at a very early stage in the ...

Verifying an extensible processor is more than a one-step process, especially when software compatibility is important.

Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may ...

A new technical paper titled “Towards Safe Autonomous Driving: A Real-Time Motion Planning Algorithm on Embedded Hardware” was published by researchers at TU Munich. Abstract “Ensuring the functional ...

Synopsys’ Secure Storage Solution for OTP IP introduces a multi-layer security architecture that pairs antifuse OTP ...

A new technical paper titled “Pushing the Envelope of LLM Inference on AI-PC and Intel GPUs” was published by researcher at ...

Understanding connectivity issues and interactions are only part of the problem; ECOs can cause unexpected problems in other areas.

2026 will continue to shine a spotlight on AI as it reshapes the EDA industry. Those companies that integrate AI into workflows, develop internal talent, and maintain the security posture required for ...

Wafer breakage is the most serious impact of killer crystalline defects. About 0.1 to 0.2% of silicon wafers break. The higher the number of wafer breakages, the slower the time to market. Given the ...

Hardware-based security; 3D-IC challenges, opportunities; resource-constrained graphics; silicon photonics; edge AI speech ...

Programmatic control, AI integration, and automated workflows for high-frequency design.

Researchers from Politecnico di Milano, Peking University, and Hewlett Packard Labs developed a Closed-Loop In-Memory ...